HYPERCLEAN STENCIL CLEANING AGENT

The perfect partner to Hyperclean rolls - Hyperclean solvents! 

Efficient removal of solder paste and SMT-adhesive residues from stencil underside grants repeatable and stable cleaning steps which help to achive highquality printing results.

The innoative formulations combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area. 

suc 61a

For all standrad stencil cleaning purposes.

This waterbased, pH-neutral cleaning media efficiantly removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process within automatic stencil printers.

Hyperclean SUC 61A shows excellent wetting properties to cleaning rolls and papers as far as stencil materials which grants stable and high quality cleaning results.

The innovative blend shows great evaporation properties and due to homogeneous formulation, smudges and cleaning media dropplets are minimized.

The cleaning media is used straight at room temperature either put within the cleaning tank of the automatic stencil printer or used straight from the original package depending on printer brand and manufacturer.

suc 63s

For hard to clean solder paste or SMD adhesives.

The innovative, pH-neutral cleaner blend efficiantly removes residues of leaded, lead-free, no-clean solder pastes and SMT-adhesives during the underside wiping process within automatic stencil printers.

Hyperclean SUC 63S shows excellent wetting properties to cleaning rolls and papers as far as stencil materials which grants stable and high quality cleaning results.

The blend can additionally be used within suitable automatic cleaning equipment.

The cleaning media is used straight at room temperature either put within the cleaning tank of the automatic stencil printer or used straight from the original package depending on printer brand and manufacturer.

The cleaning tank of suitable automatic equipment is filled up in a similar way.