Open cavity

Mirror Semiconductor is an affiliated company of TopLine. They offer Open Cavity (air cavity) M-QFN packages.


Open Cavity packagages are excellent for fabless semiconductor prototype, probing, MEMS, RF-Microwave. Use for R&D, laboratory projects and pre-production where low volume, low cost is required.

Singulated, ready for die attach and wire-bond. Cover with lid or fill with glob-top.

Open-CHip

The Open carrier is the basis of the Open Cavity package and can be completed with lids or filled with glop-top.

Flat LidS

Flat lids for cavity package.

Dome LidS

Dome lids for tall die and flat substrate package.

SocketS

Socket with top open window.

Excellent for probing into the cavity of M-QFN while measuring outputs on bottom of QFN package.

Engineering Evaluation Kits

Engineering kits are a convenient way to evaluate Open cavity (air cavity) package applications.

Bonding Wire

Tanaka is the premier manufacturer of bonding wire to the semiconductor industry.

Tanaka offers a full range of Gold (Au), Silver (Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper, covering all applications of wedge, ball and bump bonding.