BGA solutions for harsh environment

Together with TopLine, we can offer harsh envirionment solutions for BGAs. 

Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics.

Column Grid array

Solder columns are 10x more reliable than solder balls when attaching large size ceramic IC packages to FR4 or polyimide PC Boards operating in harsh environments.

Micro-coil Springs

Micro-coil springs are a novel interconnect for CCGA IC packages for harsh environments.

The coils can absorb extreme shock of up to 50 000g

Elastomer Core Solder ball

Solder balls offer non-collapse during reflow and maintain spherical shape during it. They are dimensionally constant - which improves MHz operating frequency.