TopLine Exhibiting CCGA, Solder Joint Reliability Solutions at SMT/Hybrid/Packaging

TopLine will exhibit for the 20th straight year at SMT/Hybrid/Packaging Exhibition in Nuremberg, Germany, May 16 -18, 2017 in Stand #A4-120.

TopLine CCGA non-collapsible solder column TopLine CCGA non-collapsible solder column

Featured TopLine products will include CCGA - Column Grid Arrays and daisy chain BGA test vehicles. CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs), and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.

Please contact us for more information and meeting.