Etimol SUC 61 RAN

€ 61.57
Excl. tax
Comment to store:
The water-based, pH-neutral cleaning medium efficiently removes residues of solder pastes containing lead, lead-free or so-called No-Clean solder pastes as well as of SMT adhesives from the underside of the stencil.

After the printing process, Etimol SUC 61 RAN optimally wets both the cleaning roller or the cleaning fleece as well as the underside of the stencil, so that constant high and qualitatively reproducible cleaning results are achieved.  SUC 61 is the perfect partner for Hyperclean stencil rolls.

The innovative homogeneous formula and the optimal drying behavior grant reliable process stability, printing repeatability and defined solder paste printing sharpness.